EANS-News: 80 Plus GIGA HS: Semiconductor Innovation by PVA TePla for Microchip Packaging
-------------------------------------------------------------------------------- Corporate news transmitted by euro adhoc. The issuer/originator is solely responsible for the content of this announcement. -------------------------------------------------------------------------------- New Products Wettenberg (euro adhoc) - - New industry standards for throughput - Higher yield - 100x300mm leadframe ready - Presented at SEMICON Taiwan 2012 (Kirchheim/Munich, October 19, 2012) - The business unit Plasma Systems of PVA TePla in Kirchheim/Munich unveiled the next generation strip processing plasma system (100x300mm leadframe ready - High Speed Plasma), setting new industry standards in throughput at SEMICON Taiwan 2012. The 80 Plus High Speed (HS) is the only single chamber system in the world featuring patent pending innovations in strip size conversion, handling and process, allowing up to three times higher units per hour (UPH) compared to other leadframe and substrate strip processing plasma systems to date. The system is targeted at high volume chip manufacturers improving yield and reliability for applications prior wire bonding, mold and flip chip underfill. The 80 Plus High Speed is available in radio frequency (RF) and microwave (MW) technology to provide the best process solution to meet customer demands. In semiconductor microchip packaging plasma -prior wirebonding- is essential for improving the cleanliness of the bond pads. Ball shear and stitch pull strengths are dramatically enhanced by plasma cleaning. Plasma cleaning and activation is used in applications of adhesion promotion of mold compounds, eliminating yield loss due to delamination. In Flip Chip packaging technology MW plasma prior underfill has become a must for yield improvement. Advanced Flip Chip devices are gaining in market prominence, and microwave plasma processes are unrivalled at penetrating the minute gaps beneath the dies. Further inquiry note: Helge Lüsebrink PVA TePla AG Ammerthalstrasse 34 85551 Kirchheim/Munich Germany Phone +49(0)89 905 03 - 126 Fax +49(0)89 905 03 - 147 helge.luesebrink@pvatepla.com www.pvatepla.com ; www.pvateplaamerica.com ; Product information is available: http://www.tepla.com/semi.php end of announcement euro adhoc -------------------------------------------------------------------------------- company: PVA TePla AG Im Westpark 10-12 D-35435 Wettenberg phone: +49(0)641 68690-0 FAX: +49(0)641 68690-800 mail: ir@pvatepla.com WWW: http://www.pvatepla.com sector: Misc. Industrials ISIN: DE0007461006 indexes: CDAX stockmarkets: free trade: Hannover, Berlin, München, Hamburg, Düsseldorf, Stuttgart, regulated dealing/prime standard: Frankfurt language: English
Original-Content von: PVA TePla AG, übermittelt durch news aktuell