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LPKF Laser & Electronics AG

LPKF and BASF close know-how and licence agreement

Garbsen/Hannover/Ludwigshafen (ots)

Laser manufacturer LPKF AG
and the plastic producer BASF AG signed a know-how and licence
agreement covering the LDS method for the production of 3D electronic
circuits (3D-MID). This agreement makes new materials (PA, POM, PES
and PSU) available worldwide for the LPKF LDS method.
The high performance technical plastics made by BASF AG are
already used for the production of electronic housings and
components. The semi-aromatic PA Ultramid T in particular stands out
for its high temperature resistance and is therefore ideal for
soldering and withstanding extremely high thermal loads.
The LDS method developed by LPKF  (Laser Direct Structuring)
enables the electronics industry to create circuits directly on the
surface of three dimensional plastic components. The LDS method
involves the production of moulded components by conventional means
using specially modified plastics. The surface is then activated by
an LPKF laser along the precise tracks specified by the individual
circuit layout. In the next step, copper conducting lines are
deposited along these activated tracks in a chemical bath. Typical
applications for this method are the antennae structures in mobile
phones, sensors for security technology, or plastic components for
the automotive industry.
The LDS technology developed by LPKF is an important mechatronic
milestone - the integration of electronic components within
functional mechanical parts. The combination of BASF materials and
LPKF 3D laser systems is another breakthrough opening up new
possibilities for 3D-MID applications.
ots Original Text Srevice: LPKF Laser & Electronics AG
Internet: http://www.presseportal.de

Contact:

LPKF Laser & Electronics AG
Ulrike Thoms-von Meding Tel.: 05131/7095-382
Osteriede 7, D-30827 Garbsen E-Mail: u.thomsvonmeding@lpkf.de

Original content of: LPKF Laser & Electronics AG, transmitted by news aktuell

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